Arrays Of Memory Cells Individually Comprising A Capacitor And A Transistor And Methods Of Forming Such Arrays

ABSTRACT

An array of memory cells individually comprising a capacitor and a transistor comprises, in a first level, alternating columns of digitlines and conductive shield lines. In a second level above the first level there are rows of transistor wordlines. In a third level above the second level there are rows and columns of capacitors. In a fourth level above the third level there are rows of transistor wordlines. In a fifth level above the fourth level there are alternating columns of digitlines and conductive shield lines. Other embodiments and aspects are disclosed, including method.

TECHNICAL FIELD

Embodiments disclosed herein pertain to arrays of memory cellsindividually comprising a capacitor and a transistor.

BACKGROUND

Memory is one type of integrated circuitry, and is used in computersystems for storing data. Memory may be fabricated in one or more arraysof individual memory cells. Memory cells may be written to, or readfrom, using digitlines (which may also be referred to as bit lines, datalines, sense lines, or data/sense lines) and wordlines (which may alsobe referred to as access lines). The digitlines may conductivelyinterconnect memory cells along columns of the array, and the wordlinesmay conductively interconnect memory cells along rows of the array. Eachmemory cell may be uniquely addressed through the combination of adigitline and a wordline.

A continuing goal in fabrication of memory circuitry is to makeever-smaller and closer-spaced components of memory cells.Unfortunately, undesired parasitic capacitance occurs and increases thecloser conductors are placed next to one another and can adverselyimpact design and operation of memory circuitry.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic cross-sectional view of a substrateconstruction in accordance with an embodiment of the invention, and istaken through line 1-1 in FIG. 2.

FIG. 2 is a cross-sectional view of part of the FIG. 1 construction, andis taken through line 2-2 in FIG. 1.

FIG. 3 is a diagrammatic perspective view of the FIGS. 1 and 2constructions wherein certain materials have been removed for clarity.

FIG. 4 is a diagrammatic cross-sectional view of a substrateconstruction in accordance with an embodiment of the invention.

FIG. 5 is a diagrammatic cross-sectional view of a substrateconstruction in accordance with an embodiment of the invention.

FIG. 6 is a diagrammatic cross-sectional view of a portion of apredecessor construction to that of FIG. 1 in process in accordance withan embodiment of the invention.

FIG. 7 is a view of the FIG. 6 construction at a processing stepsubsequent to that shown by FIG. 6.

FIG. 8 is a view of the FIG. 7 construction at a processing stepsubsequent to that shown by FIG. 7.

FIG. 9 is a diagrammatic cross-sectional view of a portion of apredecessor construction to that of FIG. 1 in process in accordance withan embodiment of the invention.

FIG. 10 is a view of the FIG. 9 construction at a processing stepsubsequent to that shown by FIG. 9.

FIG. 11 is a view of the FIG. 10 construction at a processing stepsubsequent to that shown by FIG. 10.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Embodiments of the invention include arrays of memory cells individuallycomprising a capacitor and a transistor, and methods of forming sucharrays. Example embodiments are initially described with reference toFIGS. 1-3 which show an example fragment of a substrate construction 8comprising an array or array area 10 that has been fabricated relativeto a base substrate 11 (FIG. 1). Substrate 11 may comprise any one ormore of conductive/conductor/conducting (i.e., electrically herein),semiconductive/semiconductor/semiconducting, andinsulative/insulator/insulating (i.e., electrically herein) materials.Various materials are above base substrate 11. Materials may be aside,elevationally inward, or elevationally outward of the FIGS. 1-3-depictedmaterials. For example, other partially or wholly fabricated componentsof integrated circuitry may be provided somewhere above, about, orwithin base substrate H. Control and/or other peripheral circuitry foroperating components within a memory array may also be fabricated, andmay or may not be wholly or partially within a memory array orsub-array. Further, multiple sub-arrays may also be fabricated andoperated independently, in tandem, or otherwise relative one another. Asused in this document, a “sub-array” may also be considered as an array.For better clarity of certain operative components, FIG. 3 does not showbase substrate 11 and does not show surrounding dielectric isolatingmaterial.

Array 10 comprises memory cells 75 that individually comprise acapacitor 85 and a transistor 25. In one embodiment, transistors 25 areelevationally-extending transistors, and in one such embodiment arevertical or within 10° of vertical. In one embodiment, memory cells 75individually have a total of only one transistor and a total of only onecapacitor (e.g., a 1T-1C memory cell having only one transistor and onlyone capacitor and no other/additional operable electronic component[e.g., no other select device, etc.]). Array 10 comprises a first level12 having therein alternating columns 14 of digitlines 16 and columns 18of conductive shield lines 20 (e.g., which in operation shield from orat least reduce parasitic capacitance between immediately-adjacentdigitlines 16 than would otherwise occur in the absence of a shield line20). Use of “column” and “row” in this document is for convenience indistinguishing one series of lines from another series of lines. Thecolumns may be straight and/or curved and/or parallel and/or notparallel relative one another, as may be the rows. Further, the columnsand rows may intersect relative one another at 90° or at one or moreother angles. Lines 16 and 20 may comprise, consist essentially of, orconsist of any suitable conductive material(s), for exampleconductively-doped semiconductor material and/or metal material. Shieldlines 20 may be narrower than digitlines 16 (e.g., by 50%), for exampleas shown.

FIGS. 1-3 show an example ideal embodiment where first-level columns 14of digitlines 16 and first-level columns 18 of conductive shield lines20 alternate every-other-one with one another such that everyimmediately-adjacent of first-level digitlines 16 have one offirst-level conductive shield lines 20 laterally there-between and suchthat every immediately-adjacent of first-level conductive shield lines20 have one of first-level digitlines 16 laterally there-between.However, in one embodiment, one of the first-level conductive shieldlines is laterally between every immediately-adjacent of the first-leveldigitlines regardless of what may be laterally betweenimmediately-adjacent shield lines (e.g., two or more shield lines may belaterally between every or some immediately-adjacent first-leveldigitlines). Yet further alternately, the columns of digitlines and thecolumn of conductive shield lines may alternate in other manners, forexample pairs of two immediately-adjacent digitlines alternating withpairs of two immediately-adjacent conductive shield lines, or otherwise.

Array 10 has a second level 22 having therein elevationally-extendingtransistors 25 individually comprising an upper source/drain region 24,a lower source/drain region 26, and a channel region 28 extendingelevationally there-between. Rows 30 of second-level wordlines 32 (e.g.,comprising, consisting essentially of, or consisting ofconductively-doped semiconductor material and/or metal material) extendoperatively adjacent individual second-level channel regions 28 ofindividual second-level transistors 25 of individual memory cells 75within array 10 and interconnect second-level transistors 25 in thatsecond-level row 30. A gate insulator 34 (e.g., comprising, consistingessentially of, or consisting of silicon dioxide, silicon nitride,and/or ferroelectric material) is between wordlines 32 and channelregion 28. Each of source/drain regions 24, 26 comprises at least a partthereof having a conductivity-increasing dopant therein that is ofmaximum concentration of such conductivity-increasing dopant within therespective source/drain region 24, 26, for example to render such partto be conductive (e.g., having a maximum dopant concentration of atleast 10¹⁹ atoms/cm³). Accordingly, all or only part of each ofsource/drain region 24, 26 may have such maximum concentration ofconductive-increasing dopant. Source/drain regions 24 and/or 26 mayinclude other doped regions (not shown), for example halo regions, LDDregions, etc. Channel region 28 may be suitably doped with aconductivity-increasing dopant likely of the opposite conductivity-typeof the dopant in source/drain regions 24, 26, and for example that is ata maximum concentration in the channel region of no greater than 1×10¹⁶atoms/cm³. When suitable voltage is applied to wordlines 32, aconductive channel can form within channel region 28 such that currentcan flow between source/drain regions 24 and 26. Individual offirst-level digitlines 16 are electrically coupled to, in one embodimentdirectly electrically coupled to, an individual lower source/drainregion 26 of individual second-level transistors 25, with suchdigitlines interconnecting second-level transistors 25 along asecond-level column.

Array 10 has a third level 36 above second level 22 having therein rowsand columns of capacitors 85. In one embodiment, capacitors 85 arearrayed in a 2D Bravais lattice. In one such embodiment, the 2D Bravaislattice is not hexagonal or centered rectangular, and in one embodimentis one of square or non-centered rectangular, with a square 2D Bravaislattice being shown. However, other Bravais lattices (e.g., hexagonal orcentered rectangular) and non-Bravais lattices may be used.

Capacitors 85 individually comprise a first capacitor electrode 38 x or38 y (conductive material), a second capacitor electrode 40 (conductivematerial), and capacitor insulator 42 material (e.g., silicon dioxide,silicon nitride, and/or ferroelectric material) between, in oneembodiment laterally between, the first and second capacitor electrodes.Second capacitor electrode 40 is not shown in FIG. 3 for clarity ofother components. In one embodiment, each of capacitor electrodes has atleast one capacitor electrode (e.g., 38 x/ 38 y) that is taller than itis wide. In one such embodiment, the one capacitor electrode (e.g., 38x/ 38 y) is a pillar having a substantially circular periphery 39.Regardless, in one such embodiment, each of capacitors 85 has only onecapacitor electrode (e.g., 38 x/ 38 y) that is taller than it is wide,with each of capacitors 85 having its other capacitor electrode (e.g.,40) being common to all of capacitors 85 in third level 36 of array 10,with such common other electrode in array 10 being wider than it istall. In one embodiment and as shown, individual ones of the firstcapacitor electrodes (e.g., 38 x) are electrically coupled to, in oneembodiment directly electrically coupled to, and extend elevationallyupward from individual upper source/drain regions 24 of individualsecond-level transistors 25.

A fourth level 46 is above third level 36 and has thereinelevationally-extending transistors 25 analogous to transistors 25described above with respect to second level 22. However, individualothers of the first capacitor electrodes (e.g., 38 y) are electricallycoupled to, in one embodiment directly electrically coupled to,individual of lower source/drain regions 26 of individual fourth-leveltransistors 25.

A fifth level 50 is above fourth level 46 and therein has columns 14 ofdigitlines 16 and columns 18 of conductive shield lines 20. Individualof fifth-level digitlines 16 are electrically coupled to, in oneembodiment directly electrically coupled to, an individual uppersource/drain region 24 of individual fourth-level transistors 25 andinterconnect fourth-level transistors 25 in a fourth-level column. Thealternating relationship(s) of columns 14 and 18 in fifth level 50 maybe the same as or different from, and may have any of the attributes of,the described alternatings of columns 14 and 18 in second level 22. Inone ideal embodiment and as shown, fifth-level columns 14 of digitlines16 and fifth-level columns 18 of conductive shield lines 20 alternateevery-other-one with one another such that every immediately-adjacent offifth-level digitlines 16 have one of fifth-level conductive shieldlines 20 laterally there-between and such that everyimmediately-adjacent of fifth-level conductive shield lines 20 have oneof fifth-level digitlines 16 laterally there-between. Dielectricmaterial 35 (e.g., silicon dioxide and/or silicon nitride; FIG. 1) isshown surrounding the structures described above. In operation,conductive shield lines 20 would likely be controlled at one or more ofpositive voltage, negative voltage, or ground (as opposed to beingallowed to “float”) to reduce parasitic capacitance betweenimmediately-adjacent digitlines 16.

Multiple example arrays as shown and/or described above may be stackedone atop another, including a stack comprising more than two of sucharrays. For example, FIG. 4 shows an alternate example construction 8 a.Like numerals from the first-described embodiments have been used whereappropriate, with some construction differences being indicated with thesuffix “a” or with different numerals. Array 10 in construction 8 a maybe considered as a first array 10. Construction 8a comprises another ofsaid first array (e.g., designated with numeral 100) above first array10. In such example embodiment, first level 12 of another first array100 is above fifth level 50 of first array 10 (e.g., separated by aninsulator level 90 [e.g., silicon dioxide and/or silicon nitride], asshown). Arrays 10 and 10 a need not be of identical constructionrelative one another.

FIG. 5 shows an alternate example embodiment construction 8 b. Likenumerals from the above-described embodiments have been used whereappropriate, with some construction differences being indicated with thesuffix “b”. In construction 10 b, fifth level 50 of first array 10 isfirst level 12 of another first array 100 such that alternating columns14, 18 of digitlines 16 and conductive shield lines 20, respectively,therein are shared by first array 10 and another first array 100. Arrays10 and 10 b need not be of identical construction relative one another.Regardless, any other attribute(s) or aspect(s) as shown and; ordescribed herein may be used in the FIGS. 4 and 5 embodiments.

Embodiments of the invention comprise an array of memory cellsindividually comprising a capacitor and a transistor. Such an arraycomprises, in a first level, alternating columns of digitlines andconductive shield lines. A second level is above the first level andtherein has rows of transistor wordlines. A third level is above thesecond level and has therein rows and columns of capacitors. A fourthlevel is above the third level and has therein rows of transistorwordlines. A fifth level is above the fourth level and has thereinalternating columns of digitlines and conductive shield lines. Such anarray may have any of the attributes described above with respect tofeatures 14, 16, 18, 20, 85, 30, and 32, yet also independent of anyattribute described above for such features. Any other attribute(s) oraspect(s) as shown and/or described herein may be used.

Embodiments of the invention encompass methods of forming an array ofmemory cells individually comprising a capacitor and a transistor,wherein the array comprises, in a first level, alternating columns ofdigitlines and conductive shield lines. A second level is above thefirst level and therein has rows of transistor wordlines. A third levelis above the second level and has therein rows and columns ofcapacitors. A fourth level is above the third level and has therein rowsof transistor wordlines. A fifth level is above the fourth level and hastherein alternating columns of digitlines and conductive shield lines.Such a method comprises, in at least one of the first and fifth levels,forming one of the columns of the conductive shield lines therein or thecolumns of the digitlines therein in a self-aligned manner using theother of the conductive shield lines therein or the columns of thedigitlines therein as a template.

An example method of forming the conductive shield lines in at least oneof the first and fifth levels is next described with reference to FIGS.6-8. Like numerals from the above-described embodiments have been usedfor predecessor materials and constructions, with some constructiondifferences being indicated with different numerals.

Referring to FIG. 6, an example portion of a predecessor construction 8to that of FIG. 1 is shown. Columns 14 of digitlines 16 are shown ashaving been formed in at least one of first level 12 or fifth level 50.Accordingly, the processing of FIGS. 6-8 may be considered as occurringin only one of levels 12 and 50, or in both.

Referring to FIG. 7, material 60 has been formed betweenimmediately-adjacent of digitlines 16 to less-than-fill space that islaterally between such immediately-adjacent digitlines with suchmaterial in the one of the first and fifth levels and to leave voidspace 62 laterally between such immediately-adjacent digitlines in theone of the first and fifth levels. Material 60 may be dielectric and atleast largely remain in a finished-circuitry-construction of the array.Alternately, material 60 may be dielectric and not largely remain in afinished-circuitry-construction of the array. Still and alternately,material 60 may be at least largely sacrificial (e.g., being any one ormore conductive, dielectric, and/or semiconductive) and does not largelyremain in a finished-circuitry-construction of the array. Ideally, theFIG. 7 construction is formed in a self-aligned manner, for example byconformally depositing material 60 and at the example depth depictedwhereby lateral gaps (e.g., predecessor to void spaces 62) naturallyform between and using digitlines 16 as a template. Thereafter, material60 at the bases of those lateral gaps may be removed by masklessspacer-like anisotropic etching (i.e., being maskless at least withinarray 10) such that bases of digitlines 16 and conductive shield lines20 may ultimately be elevationally coincident. Alternately, but lessideal, material 60 may be deposited and subsequently patterned using amask, for example using photolithography and etch.

Referring to FIG. 8, conductive material of conductive shield lines 20has been formed in the void space 62 that is laterally betweenimmediately-adjacent digitlines 16 in the depicted one of the first andfifth levels.

An example method of forming the digitlines in at least one of the firstand fifth levels is next described with reference to FIGS. 9-11. Likenumerals from the above-described embodiments have been used forpredecessor materials and constructions.

Referring to FIG. 9, an example portion of a predecessor construction 8to that of FIG. 1 is shown. Columns 18 of conductive shield lines 20 areshown a having been formed in at least one of first level 12 or fifthlevel 50. Accordingly, the processing of FIGS. 9-10 may be considered asoccurring in only one of levels 12 and 50, or in both.

Referring to FIG. 10, material 60 has been formed betweenimmediately-adjacent of conductive shield lines 20 to less-than-fillspace that is laterally between such immediately-adjacent shield lineswith such material in the one of the first and fifth levels and to leavevoid space 62 laterally between such immediately-adjacent shield linesin the one of the first and fifth levels. Ideally, the FIG. 10construction is formed in a self-aligned manner, for example byconformally depositing material 60 and at the example depth depictedwhereby lateral gaps (e.g., predecessor to void spaces 62) naturallyform between and using conductive shield lines 20 as a template.Thereafter, material 60 at the bases of those lateral gaps may beremoved by maskless spacer-like anisotropic etching (i.e., beingmaskless at least within array 10) such that bases of digitlines 16 andconductive shield lines 20 may ultimately be elevationally coincident.Alternately, but less ideal, material 60 may be deposited andsubsequently patterned using a mask, for example using photolithographyand etch.

Referring to FIG. 11, conductive material of digitlines 16 has beenformed in the void space 62 that is laterally betweenimmediately-adjacent shield lines 20 in the depicted one of the firstand fifth levels.

Any attribute(s) or aspect(s) as shown and/or described herein withrespect to structure embodiments may be used in method embodiments andvice versa. Pitch multiplication principles may be used in methodaspects of the invention (e.g., features may be formed along a sidewallof another feature to have lateral thickness that is less than lateralthickness of the other feature regardless of how such other feature wasformed).

In this document unless otherwise indicated, “elevational”, “higher”,“upper”, “lower”, “top”, “atop”, “bottom”, “above”, “below”, “under”,“beneath”, “up”, and “down” are generally with reference to the verticaldirection.

“Horizontal” refers to a general direction (i.e., within 10 degrees)along a primary substrate surface and may be relative to which thesubstrate is processed during fabrication, and vertical is a directiongenerally orthogonal thereto. Reference to “exactly horizontal” is thedirection along the primary substrate surface (i.e., no degreesthere-from) and may be relative to which the substrate is processedduring fabrication. Further, “vertical” and “horizontal” as used hereinare generally perpendicular directions relative one another andindependent of orientation of the substrate in three-dimensional space.Additionally, “elevationally-extending” and “extend(ing) elevationally”refer to a direction that is angled away by at least 45° from exactlyhorizontal. Further, “extend(ing) elevationally”,“elevationally-extending”, extend(ing) horizontally, andhorizontally-extending with respect to a field effect transistor arewith reference to orientation of the transistor's channel length alongwhich current flows in operation between the source/drain regions. Forbipolar junction transistors, “extend(ing) elevationally”“elevationally-extending”, extend(ing) horizontally, andhorizontally-extending, are with reference to orientation of the baselength along which current flows in operation between the emitter andcollector.

Further, “directly above” and “directly under” require at least somelateral overlap (i.e., horizontally) of two statedregions/materials/components relative one another. Also, use of “above”not preceded by “directly” only requires that some portion of the statedregion/material/component that is above the other be elevationallyoutward of the other (i.e., independent of whether there is any lateraloverlap of the two stated regions/materials/components). Analogously,use of “under” not preceded by “directly” only requires that someportion of the stated region/material/component that is under the otherbe elevationally inward of the other (i.e., independent of whether thereis any lateral overlap of the two stated regions/materials/components).

Any of the materials, regions, and structures described herein may behomogenous or non-homogenous, and regardless may be continuous ordiscontinuous over any material which such overlie. Further, unlessotherwise stated, each material may be formed using any suitable oryet-to-be-developed technique, with atomic layer deposition, chemicalvapor deposition, physical vapor deposition, epitaxial growth, diffusiondoping, and ion implanting being examples.

Additionally, “thickness” by itself (no preceding directional adjective)is defined as the mean straight-line distance through a given materialor region perpendicularly from a closest surface of animmediately-adjacent material of different composition or of animmediately-adjacent region. Additionally, the various materials orregions described herein may be of substantially constant thickness orof variable thicknesses. If of variable thickness, thickness refers toaverage thickness unless otherwise indicated, and such material orregion will have some minimum thickness and some maximum thickness dueto the thickness being variable. As used herein, “different composition”only requires those portions of two stated materials or regions that maybe directly against one another to be chemically and/or physicallydifferent, for example if such materials or regions are not homogenous.If the two stated materials or regions are not directly against oneanother, “different composition” only requires that those portions ofthe two stated materials or regions that are closest to one another bechemically and/or physically different if such materials or regions arenot homogenous. In this document, a material, region, or structure is“directly against” another when there is at least some physical touchingcontact of the stated materials, regions, or structures relative oneanother. In contrast, “over”, “on”, “adjacent”, “along”, and “against”not preceded by “directly” encompass “directly against” as well asconstruction where intervening material(s), region(s), or structure(s)result(s) in no physical touching contact of the stated materials,regions, or structures relative one another.

Herein, regions-materials-components are “electrically coupled” relativeone another if in normal operation electric current is capable ofcontinuously flowing from one to the other, and does so predominately bymovement of subatomic positive and/or negative charges when such aresufficiently generated. Another electronic component may be between andelectrically coupled to the regions-materials-components. In contrast,when regions-materials-components are referred to as being “directlyelectrically coupled”, no intervening electronic component (e.g., nodiode, transistor, resistor, transducer, switch, fuse, etc.) is betweenthe directly electrically coupled regions-materials-components.

Additionally, “metal material” is any one or combination of an elementalmetal, a mixture or an alloy of two or more elemental metals, and anyconductive metal compound.

Also, “self-aligned” or “self-aligning” means a technique whereby atleast one pair of opposing edges of a structure is formed by a pair ofpreviously-defined edges, thereby not requiring subsequentphotolithographic processing with respect to those opposing edges.

CONCLUSION

In some embodiments, an array of memory cells individually comprising acapacitor and a transistor comprises, in a first level, alternatingcolumns of digitlines and conductive shield lines. In a second levelabove the first level there are rows of transistor wordlines. In a thirdlevel above the second level there are rows and columns of capacitors.In a fourth level above the third level there are rows of transistorwordlines. In a fifth level above the fourth level there are alternatingcolumns of digitlines and conductive shield lines.

In some embodiments, an array of memory cells individually comprising acapacitor and a transistor comprises, in a second level above a firstlevel, elevationally-extending transistors individually comprising anupper source/drain region, a lower source/drain region, and a channelregion extending elevationally there-between. Rows of second-levelwordlines extend operatively adjacent individual of the second-levelchannel regions of individual second-level transistors of individualmemory cells within the array and interconnect the second-leveltransistors in that second level row. In the first level, there arealternating columns of digitlines and columns of conductive shieldlines. Individual of the first-level digitlines are electrically coupledto an individual lower source/drain region of the individualsecond-level transistors and interconnect the second-level transistorsin a second-level column. One of the first-level conductive shield linesis laterally between every immediately-adjacent of the first-leveldigitline. A third level is above the second level, and comprisescapacitors that individually comprise a first capacitor electrode, asecond capacitor electrode, and a capacitor insulator between the firstand second capacitor electrodes. Individual ones of the first capacitorelectrodes are electrically coupled to and extend elevationally upwardfrom individual of the upper source/drain regions of the individualsecond-level transistors. In a fourth level above the third level,elevationally-extending transistors individually comprise an uppersource/drain region, a lower source/drain region, and a channel regionextending elevationally there-between. Rows of fourth-level wordlinesextend operatively adjacent individual of the fourth-level channelregions of individual fourth-level transistors of individual memorycells within the array and interconnect the fourth-level transistors inthat fourth-level row. Individual others of the first capacitorelectrodes are electrically coupled to individual of the lowersource/drain regions of individual fourth-level transistors. In a fifthlevel above the fourth level, there are columns of digitlines andcolumns of conductive shield lines. Individual of the fifth-leveldigitlines are electrically coupled to an individual upper source/drainregion of the individual fourth-level transistors and interconnect thefourth-level transistors in a fourth-level column. One of thefifth-level conductive shield lines is laterally between everyimmediately-adjacent of the fifth-level digitlines.

Some embodiments are a method of forming an array of memory cellsindividually comprising a capacitor and a transistor. The arraycomprises, in a first level, alternating columns of digitlines andconductive shield lines. In a second level above the first level thereare rows of wordlines. In a third level above the second level there arerows and columns of capacitors. In a fourth level above the third levelthere are rows of wordlines. In a fifth level above the fourth levelthere are alternating columns of digitlines and conductive shield lines.The method comprises, in at least one of the first and fifth levels,forming one of the columns of the conductive shield lines therein or thecolumns of the digitlines therein in a self-aligned manner using theother of the conductive shield lines therein or the columns of thedigitlines therein as a template.

Some embodiments are a method of forming an array of memory cellsindividually comprising a capacitor and a transistor. The arraycomprises, in a first level, alternating columns of digitlines andconductive shield lines. In a second level above the first level thereare rows of wordlines. In a third level above the second level there arerows and columns of capacitors. In a fourth level above the third levelthere are rows of wordlines. In a fifth level above the fourth levelthere are alternating columns of digitlines and conductive shield lines.The method comprises, in at least one of the first and fifth levels,forming the conductive shield lines therein sequentially comprisingforming the columns of the digitlines. Material is formed betweenimmediately-adjacent of the digitlines to less-than-fill space that islaterally between said immediately-adjacent digitlines with saidmaterial in the one of the first and fifth levels and to leave voidspace laterally between said immediately-adjacent digitlines in the oneof the first and fifth levels. Conductive material of the conductiveshield lines is formed in the void space that is laterally between saidimmediately-adjacent digitlines in the one of the first and fifthlevels.

Some embodiments are a method of forming an array of memory cellsindividually comprising a capacitor and a transistor. The arraycomprises, in a first level, alternating columns of digitlines andconductive shield lines. In a second level above the first level thereare rows of wordlines. In a third level above the second level there arerows and columns of capacitors. In a fourth level above the third levelthere are rows of wordlines. In a fifth level above the fourth levelthere are alternating columns of digitlines and conductive shield lines.The method comprises, in at least one of the first and fifth levels,forming the digitlines therein sequentially comprising forming thecolumns of the conductive shield lines. Material is formed betweenimmediately-adjacent of the conductive shield lines to less-than-fillspace that is laterally between said immediately-adjacent conductiveshield lines with said material in the one of the first and fifth levelsand to leave void space laterally between said immediately-adjacentconductive shield lines in the one of the first and fifth levels.Conductive material of the digitlines is formed in the void space thatis laterally between said immediately-adjacent conductive shield linesin the one of the first and fifth levels.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1-29. (canceled)
 30. An array of memory cells individually comprising acapacitor and a transistor, comprising: in a first level, alternatingcolumns of digitlines and conductive shield lines; in a second levelabove the first level, rows of transistor wordlines; in a third levelabove the second level, rows and columns of capacitors; in a fourthlevel above the third level, rows of transistor wordlines; in a fifthlevel above the fourth level, alternating columns of digitlines andconductive shield lines; and at least one of individual of thecapacitors comprising a ferroelectric capacitor insulator or individualof the transistors comprising a ferroelectric gate insulator.
 31. Thearray of claim 30 wherein the individual capacitors comprise aferroelectric capacitor insulator.
 32. The array of claim 30 wherein theindividual transistors comprise a ferroelectric gate insulator,
 33. Thearray of claim 30 wherein one of the first-level conductive shield linesis laterally between every immediately-adjacent of the first-leveldigitlines.
 34. The array of claim 30 wherein the first-level columns ofdigitlines and the first-level columns of conductive shield linesalternate every-other-one with one another such that everyimmediately-adjacent of the first-level digitlines have one of thefirst-level conductive shield lines laterally there-between and suchthat every immediately-adjacent of the first-level conductive shieldlines have one of the first-level digitlines laterally there-between.35. The array of claim 30 wherein one of the fifth-level conductiveshield lines is laterally between every immediately-adjacent of thefifth-level digitlines.
 36. The array of claim 30 wherein thefifth-level columns of digitlines and the fifth-level columns ofconductive shield lines alternate every-other-one with one another suchthat every immediately-adjacent of the fifth-level digitlines have oneof the fifth-level conductive shield lines laterally there-between andsuch that every immediately-adjacent of the fifth-level conductiveshield lines have one of the fifth-level digitlines laterallythere-between.
 37. The array of claim 30 wherein transistors in each ofthe second and fourth levels are elevationally-extending transistors.38. The array of claim 37 wherein each of the transistors in the secondand fourth levels are vertical or within 10° of vertical.
 39. The arrayof claim 30 wherein each of the capacitors has at least one capacitorelectrode that is taller than it is wide.
 40. The array of claim 39wherein each of the capacitors has only one capacitor electrode that istaller than it is wide, each of the capacitors having its othercapacitor electrode that is a common to all of the capacitors in thethird level of the array, the common other electrode in the array beingwider than it is tall.
 41. The array of claim 39 wherein the onecapacitor electrode is a pillar having a substantially circularperiphery.
 42. The array of claim 30 wherein the memory cellsindividually have a total of only one transistor and a total of only onecapacitor.
 43. The array of claim 30 wherein the array is a first arrayand comprising another of said first array above said first array. 44.The array of claim 43 wherein the fifth level of the first array is thefirst level of the another of said first array such that the alternatingcolumns of digitlines and conductive shield lines therein are shared bythe first array and the another of said first array.
 45. The array ofclaim 43 wherein the first level of the another of said first array isabove the fifth level of the first array.
 46. An array of memory cellsindividually comprising a capacitor and a transistor, comprising: in afirst level, alternating columns of digitlines and conductive shieldlines; in a second level above the first level, rows of transistorwordlines; in a third level above the second level, rows and columns ofcapacitors; in a fourth level above the third level, rows of transistorwordlines; in a fifth level above the fourth level, alternating columnsof digitlines and conductive shield lines; and individual of theconductive shield lines being narrower than individual of thedigitlines.
 47. The array of claim 46 wherein one of the first-levelconductive shield lines is laterally between every immediately-adjacentof the first-level digitlines.
 48. The array of claim 46 wherein thefirst-level columns of digitlines and the first-level columns ofconductive shield lines alternate every-other-one with one another suchthat every immediately-adjacent of the first-level digitlines have oneof the first-level conductive shield lines laterally there-between andsuch that every immediately-adjacent of the first-level conductiveshield lines have one of the first-level digitlines laterallythere-between.
 49. The array of claim 46 wherein one of the fifth-levelconductive shield lines is laterally between every immediately-adjacentof the fifth-level digitlines.
 50. The array of claim 46 wherein thefifth-level columns of digitlines and the fifth-level columns ofconductive shield lines alternate every-other-one with one another suchthat every immediately-adjacent of the fifth-level digitlines have oneof the fifth-level conductive shield lines laterally there-between andsuch that every immediately-adjacent of the fifth-level conductiveshield lines have one of the fifth-level digitlines laterallythere-between.
 51. The array of claim 46 wherein each of the transistorsin the second and fourth levels are vertical or within 10° of vertical.52. The array of claim 46 wherein each of the capacitors has at leastone capacitor electrode that is taller than it is wide.
 53. The array ofclaim 52 wherein each of the capacitors has only one capacitor electrodethat is taller than it is wide, each of the capacitors having its othercapacitor electrode that is a common to all of the capacitors in thethird level of the array, the common other electrode in the array beingwider than it is tall.
 54. The array of claim 52 wherein the onecapacitor electrode is a pillar having a substantially circularperiphery.
 55. The array of claim 46 wherein the array is a first arrayand comprising another of said first array above said first array. 56.The array of claim 55 wherein the fifth level of the first array is thefirst level of the another of said first array such that the alternatingcolumns of digitlines and conductive shield lines therein are shared bythe first array and the another of said first array.
 57. The array ofclaim 55 wherein the first level of the another of said first array isabove the fifth level of the first array.